Copper Plating Electrolyte Based on Oxyethylene Diphosphonic Acid Complexes
https://doi.org/10.31615/j.corros.prot.2024.112.2-5
Abstract
Currently, there are various electrolytes for the electrochemical deposition of copper coatings. The most used of them in industry for direct coating of steel are cyanide electrolytes. Obviously, the use of cyanide electrolytes is undesirable due to their high toxicity. In a number of countries, including the Russian Federation, standards have been established that prohibit or strictly regulate the use of cyanides in various technological processes. This study’s outcomes are connected with the development of an alternative alkaline copper plating electrolyte based on hydroxyethylidene diphosphonic acid to replace toxic cyanide solutions.
The study has shown that the proposed electrolyte based on hydroxyethylidene diphosphonic acid is capable of ensuring to obtain copper coatings that are not only of high quality but also demonstrate adhesion strength to the steel base.
These results open up new vistas for the development of safe and effective alternatives to cyanide electrolytes in electrodeposition processes of copper coatings, helping to reduce the environmental load and improve the safety of technological processes in industry.
About the Authors
A. G. Kholodkova
Mendeleev University of Chemical Technology of Russia
Russian Federation
Russian Federation
Anna G. Kholodkova, graduate student,
9, Miusskaya square, Moscow, 125047.
A. A. Abrashov
Mendeleev University of Chemical Technology of Russia
Russian Federation
Russian Federation
Alexey A. Abrashov, Ph.D. of Technical Sciences, associate professor,
9, Miusskaya square, Moscow, 125047.
N. S. Grigoryan
Mendeleev University of Chemical Technology of Russia
Russian Federation
Russian Federation
Nelya S. Grigoryan, Ph.D. of Chemistry, associate professor,
9, Miusskaya square, Moscow, 125047.
T. A. Vahramyan
Mendeleev University of Chemical Technology of Russia
Russian Federation
Russian Federation
Tigran A. Vahramyan, Doctor of Technical Sciences, Professor, Head of the Department,
9, Miusskaya square, Moscow, 125047.
References
1. Agladze, R. I., Vahramyan, T. A., Hoffman, N. T., & Kudryavtsev, N. T. (1984). Applied electrochemistry, 3-rd ed. Moscow: Khimiya. (in Russ.)
2. Li, M. G., Wei, G. Y., Li, M., Wang, J. F., Chen, L. and Zhao, X. X. (2014). Effect of HEDP on copper electroplating from non-cyanide alkaline baths. Surface Engineering, 30(10). https://doi.org/10.1179/1743294414Y.0000000256
3. Patent RU 2652328 C1. (2018). Electrolyte for electrolytic deposition of copper. Pisarev, A. S., Serov, A. N., Zheludkova, E. A., Abrashov, A. A., Grigoryan, N. S., Kalinkina, A. A., Arkhipov, E. A., Vagramyan, T. A.
4. Patent CN 104152951 A. (2019). Cyanide-free alkali solution mill berry copper electroplating liquid and process. Xie Jinping, Guo Yan, Liang Yunrui, Zeng Zhenou, Wu Yaocheng, Huang Lingfei.
5. Minggang, Li, Guoying, Wei, Shuangshuang, Hu, Shuhan, Xu, Yejiong ,Yang and Qinfang, Miao. (2015). Electrodeposition of cuzn alloys from the non-cyanide alkaline baths. Surface Review and Letters, 22(1). https://doi.org/10.1142/S0218625X1550003
6. Serov, A. N., Grigoryan, N. S., Makhina, V. S., Vagramyan, T. A., Abrashov, A. A., Kasatkin, V. E. and Arkhipushkin, I. A. (2021). A study of sorption phenomena on steel surface in solutions of aminotris (methylenephosphonic acid). Int. J. Corros. Scale Inhib., 10(3), 932-942. https://doi.org/10.17675/2305-6894-2021-10-3-7
7. Nemtsev, A. D., Serov, A. N., Zheludkova, E. A., Grigoryan, N. S., Abrashov, A. A., Nyrkov, N. P., & Pisarev, A. S. (2018). Study of the process of alkaline cyanide-free copper plating. Successes in Chemistry and Chemical Technology, 32(13), 30-32. (in Russ.)
Review
For citations:
Kholodkova A.G., Abrashov A.A., Grigoryan N.S., Vahramyan T.A. Copper Plating Electrolyte Based on Oxyethylene Diphosphonic Acid Complexes. Theory and Practice of Corrosion Protection. 2024;29(2):50-58. (In Russ.) https://doi.org/10.31615/j.corros.prot.2024.112.2-5
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