Electroless Plating of Ni-Mo-P Alloy
https://doi.org/10.31615/j.corros.prot.2022.104.2-4
Abstract
Electroless plating of Ni-Mo-P alloy coatings is described from a solution containing sodium pyrophosphate and ammonium chloride as ligands. Application of these ligands allowed using relatively large sodium molybdate concentrations in the solution (8…16 mM), while the high electroless plating rate (up to 20 μm/h) was preserved and semibright coatings were obtained. Depending on the sodium molybdate concentration in the solution, Ni-Mo-P alloys contained 3.5…7.4 at.% of molybdenum in the metallic state. Phosphorus was included into the alloy in the form of nickel phosphide NiP. According to the XRD data. the Ni-Mo-P coatings had a nanocrystalline structure with the coherent scattering region size of 25…34 nm.
About the Authors
S. S. Adilova
Frumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of Sciences
Russian Federation
Russian Federation
Sabina S. Adilova, postgraduate, engineer of the 2nd category
bld. 4, 31, Leninskii prospect, Moscow
A. D. Aliev
Frumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of Sciences
Russian Federation
Russian Federation
Ali D. Aliev, Ph.D. of physical and mathematical sciences, leading researcher
bld. 4, 31, Leninskii prospect, Moscow
A. B. Drovosekov
Frumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of Sciences
Russian Federation
Russian Federation
Andrey B. Drovosekov, Ph.D. of chemical sciences, senior researcher
bld. 4, 31, Leninskii prospect, Moscow
References
1. Melo, R. L., Casciano, P. N. S., Correia, A. N., & de Lima-Neto, P. (2012). Characterisation of Electrodeposited and Heat-Treated Ni-Mo-P Coatings. J. Braz. Chem. Soc., 23(2), 328-334.
2. Lai, C., Liu, X., Wang, Y., Cao, C., Yin, Y., Yang, H., Qi, X., Zhong, S., Hou, X., & Liang, T. (2020). Modulating ternary Mo-Ni-P by electronic reconfiguration and morphology engineering for boosting allpH electrocatalytic overall water splitting. Electrochim. Act., 330, 135294.
3. Shervedani, R. K., Lasia, A. (1998). Study of the Hydrogen Evolution Reaction on Ni-Mo-P Electrodes in Alkaline Solutions. J. Electrochem. Soc., 145(7), 2219-2225.
4. Mallory, G. O., Horhn, T. R. (1979). Electroless deposition of ternary alloys. Plating and Surface Finishing, 66(4), 40-46.
5. Patent 4019910 US. Electroless nickel polyalloy plating baths. 1977.
6. Lu, G., Zangari, G. (2003). Study of the electroless deposition process of Ni-P-based ternary alloys. J. Electrochem. Soc., 150(11), 777-786.
7. Mukhina, A. E. (2008). Chemical deposition of nickel with zinc, tungsten, molybdenum and manganese. Ph.D. dissertation. Ivanovo.
8. Azhogin, F. F., Belenky, M. A., Gall, I. E. etc. (1987). Electroplating. M.: Metallurgy.
9. Vyacheslavov, P. M. (1986). Electrolytic deposition of alloys. (Library of electroplating, issue 5). Leningrad: "Engineering" Leningrad branch.
10. Drovosekov, A. B., Aliev, A. D., & Rozhansky, N. V. (2018). Chemical-catalytic deposition of Ni-W-P alloys from solutions with glycine and malic acid. Theory and Practice of Corrosion Protection, (4), 9-14.
Review
For citations:
Adilova S.S., Aliev A.D., Drovosekov A.B. Electroless Plating of Ni-Mo-P Alloy. Theory and Practice of Corrosion Protection. 2022;27(2):40-45. (In Russ.) https://doi.org/10.31615/j.corros.prot.2022.104.2-4
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