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Study of the Influence of Thiourea and Trisodium Nitrilotriacetic Acid in Immersion Silver Plating Solutions for Copper Contact Pads of Printed Circuit Boards on the Structure of Coatings
https://doi.org/10.31615/j.corros.prot.2026.120.2-3
Abstract
The article presents the results of a comprehensive study of the immersion silvering process of copper surfaces. The main focus is on studying the effect of ligand concentration on the kinetics of the deposition process and the electrochemical characteristics of the system. The objects of the research were trisodium salt of nitrilotriacetic acid and thiourea in various ratios with silver ions. During the work, the optimization of technological parameters of the deposition process was successfully carried out. The article presents a comparative analysis of the structure of coatings formed from the studied solutions, their thickness, and continuity. The results of the research can be used in the development of technological processes for applying silver coatings in the electronics industry, electronic device manufacturing, and the radio engineering sector.
About the Authors
Ekaterina A. Zheludkova
Dmitry Mendeleev University of Chemical Тесhпоlоgy of Russia
Russian Federation
Russian Federation
Ekaterina A. Zheludkova, Cand. Sci. in Technic, Associate Professor,
9, Miusskaya square, Moscow, 125047.
Daria A. Nitsuk
Dmitry Mendeleev University of Chemical Тесhпоlоgy of Russia
Russian Federation
Russian Federation
Daria A. Nitsuk, Student,
9, Miusskaya square, Moscow, 125047.
Naum A. Asnis
Dmitry Mendeleev University of Chemical Тесhпоlоgy of Russia
Russian Federation
Russian Federation
Naum A. Asnis, Cand. Sci. in Technic, Leading Engineer,
9, Miusskaya square, Moscow, 125047.
Alexey A. Abrashov
Dmitry Mendeleev University of Chemical Тесhпоlоgy of Russia
Russian Federation
Russian Federation
Alexey A. Abrashov, Cand. Sci. in Technic, Associate Professor,
9, Miusskaya square, Moscow, 125047.
Nelya S. Grigoryan
Dmitry Mendeleev University of Chemical Тесhпоlоgy of Russia
Russian Federation
Russian Federation
Nelya S. Grigoryan, Cand. Sci. in Technic, Professor,
9, Miusskaya square, Moscow, 125047.
Tigran A. Vagramyan
Dmitry Mendeleev University of Chemical Тесhпоlоgy of Russia
Russian Federation
Russian Federation
Tigran A. Vagramyan, Doctor Sci. in Technic, Professor, Head of Department,
9, Miusskaya square, Moscow, 125047.
References
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Review
For citations:
Zheludkova E.A., Nitsuk D.A., Asnis N.A., Abrashov A.A., Grigoryan N.S., Vagramyan T.A. Study of the Influence of Thiourea and Trisodium Nitrilotriacetic Acid in Immersion Silver Plating Solutions for Copper Contact Pads of Printed Circuit Boards on the Structure of Coatings. Theory and Practice of Corrosion Protection. 2026;31(2):33-45. (In Russ.) https://doi.org/10.31615/j.corros.prot.2026.120.2-3
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